LED arrangement
US7510888B2 · kind B2 · utility
15Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2007 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Mar 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.