Substrate for mounting electronic part and electronic part
US7511232B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2006 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Aug 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3463
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is characterized by a structure having a substrate 1, and metallization layers 2 formed on the substrate 1, on which a Sn solder film 3 and an Ag film 4 are formed. The Ag film 4 is a metal free from oxidization at room temperature in the atmosphere. In a wet process, since only an exposed side of the Sn solder film 3 is oxidized by the cell reaction of Ag and Sn, an upper surface of the Ag film 4 on the solder film, which would otherwise affect the connection, is not oxidized. Since the Ag film 4 melts into the Sn solder simultaneously with melting of the Sn solder film 3, the Ag film 4 does not hinder the connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.