Image sensor module structure with lens holder having vertical inner and outer sidewalls
US7511261B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Aug 21, 2004 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Aug 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8592
Abstract
An image sensor module structure includes a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The chip is mounted on the upper surface, and is electrically connected to the first electrodes. The lens holder has an upper end face, a lower end face, and an opening penetrating through the lens holder. The upper end portion of the opening is formed with an internal thread, and the lower end portion of the opening is formed with a breach. The lens holder is adhered on the upper surface by glue. The photosensitive chip is located within the opening of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.