Light emitting device with excellent heat resistance and light resistance
US7511424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2006 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Apr 24, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A light emitting device is provided, including a light emitting element, a package comprised at least partially of metal on which said light emitting element is mounted, and a resin layer coated on said light emitting element. The light emitting element is eutectic bonded to a metal portion of said package, and the resin layer is formed of a cured product of a silicone composition. The composition includes (i) an organopolysiloxane having an average composition formula (1):R1a(OX)bSiO(4−a−b)/2 (1)wherein R1 is an alkyl, alkenyl or aryl group, X is a hydrogen atom, or an alkyl, alkenyl, alkoxyalkyl or acyl group, a is a number from 1.05 to 1.5, b is a number of 0<b<2, and 1.05<a+b<2, and (ii) a condensation catalyst. The device exhibits improved heat resistance and light resistance, and also exhibits improved adhesion to the resins and metal members used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.