Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit
US7511616B2 · kind B2 · utility
34Cited by
22References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2004 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Jan 21, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A curable adhesive composition is provided. A battery and a substrate to which the battery is to be conductively connected are also provided. The adhesive composition is interposed between the battery and the substrate. In another aspect, a curable epoxy composition is interposed between first and second electrically conductive components. In another aspect, a battery powerable apparatus, such as an RF communication device or RFID device, is coupled to a battery via a conductive epoxy. In another aspect, first and second electric components are electrically connected with one another through a conductive epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.