Thermal interconnection for capacitor systems
US7511942B2 · kind B2 · utility
11Cited by
26References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 6, 2007 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Apr 6, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/70
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Thermal protection is provided in systems utilizing high-current double-layer capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.