Wafer scale method of manufacturing optical waveguide devices and the waveguide devices made thereby
US7512303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2007 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Jun 27, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2201/07
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to a wafer scale process for the manufacture of optical waveguide devices, and particularly for the manufacture of ridge waveguide devices, and the improved waveguides made thereby. The present invention has found a process for achieving sub-micron control of an optical waveguiding layer thickness by providing a dimensionally stable wafer assembly into which adhesive can be introduced without altering the planar relationship between a carrier wafer and an optically transmissive wafer in wafer scale manufacture. This process permits wafer scale manufacture of optical waveguide devices including thin optically transmissive layers. A pattern of spacer pedestals is created by a deposition and etch back, or by a surface etch process to precisely reference surface information from a master surface to a carrier wafer to a thin optically transmissive wafer. The tolerance achievable in accordance with this process provides consistent yield across the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.