In-process non-contact measuring systems and methods for automated lapping systems
US7512457B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2007 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Mar 6, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In-process non-contact measurement systems and methods for automated lapping systems are disclosed. In an embodiment, a moveable frame can be controllably positioned proximate to a lapped work product. A control component can provide first control signals to control a movement of the moveable frame relative to the lapped work product. A non-contact measuring device can be coupled to the moveable frame measures a surface of the lapped work product and can transmit measurement data of the surface of the lapped work product to the control component. The control component can further provide second control signals to control a movement of the non-contact measuring device relative to the moveable frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.