Accurate on-die temperature measurement using remote sensing
US7512514B2 · kind B2 · utility
7Cited by
1References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Dec 19, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/015
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.