Cutting device for thin metallic plate
US7513180B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2004 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Jul 17, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/343
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting device for a thin metallic plate is provided which shortens time for shaping or the like on a cut edge to improve manufacturing efficiency, and increases the life of a cutter. The cutting device for cutting a thin metallic plate W with a predetermined width includes a shearing cutter 7 which is made of a metal having a higher hardness than the thin plate W and has a blade angle of 50 to 90°. A contacting member 5 is provided which includes a groove 8 facing the shearing cutter 7 and makes contact with the back side of the thin plate W. In the groove 8, an interval a between upper edges 9a and 9b of inner walls 9 is set at 15 to 30 times a thickness b of the thin plate W. A depth c of a deepest portion 11 in the groove 8 is set at one to three times the thickness b of the thin plate W. The inner walls 9 of the groove 8 include curved surfaces 10, each of which has a curvature radius of 15 to 50 times the thickness b of the thin plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.