Air bearing gap control for injection molded solder heads
US7513410B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2007 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Sep 10, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0623
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.