Toolless thermal print head mounting apparatus
US7513705B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2008 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Jun 20, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J25/34
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A toolless thermal print head mounting apparatus including; a print head mounting bracket including a front face and a rear face, a plurality of print head mounting stud holes and a plurality of cable clamp mounting slots formed in the print head mounting bracket, each of the plurality of cable clamp mounting slots including a side slot and a vertical slot, a capture latch operatively connected to the print head mounting bracket, a plurality of key-slots formed in the capture latch and aligned with the plurality of mounting stud holes, and a floating cable clamp including a plurality of shoulder pins disposed on a rear face thereof, each of the plurality of shoulder pins including a neck configured to pass through the plurality of cable clamp mounting slots and a head configured to be larger than a width of the vertical slot of the cable clamp mounting slots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.