Process for the plasma cleaning of a component

US7513955B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Ursus Krüger · Berlin, DE
• Ralph Reiche · Berlin, DE
• Jan Steinbach · Berlin, DE

Key dates

• Filing date: Feb 9, 2005
• Grant date: Apr 7, 2009
• Expiry date: Mar 13, 2026

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23G5/00
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Cracks are conventionally difficult to clean which often leads to damage to other regions of the component for cleaning. According to the invention, a plasma cleaning method is used, whereby a pressure and/or a separation of an electrode to the component are varied, in order to achieve a plasma cleaning in the crack.