Covered microchamber structures

US7514045B2 · kind B2 · utility

Assignee

• Avery Dennison Corporation · US

Inventors

• Craig S. Corcoran · Rockford, US
• Cindy Chiu · San Dimas, US
• William Jaecklein · Mentor, US
• Dong-Tsai Hseih · Arcadia, US
• Eng-Pi Chang · Arcadia, US
• Le-Hoa Hong · Brea, US
• Zhisong Huang · Fremont, US
• Michael Lang · Chagrin Falls, US
• Ronald F. Sieloff · Pataskala, US
• Philip Chu · Monrovia, US

Key dates

• Filing date: Jan 17, 2003
• Grant date: Apr 7, 2009
• Expiry date: Mar 27, 2026

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/058
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A microchamber structure (100) comprising a base layer (120), a lid layer (130), and at least one microchamber (140) having a cross-sectional shape with a depth (d) of less than 1000 microns and a width (w) of less than 1000 microns. The base layer (120) includes a depression (122) and the lid layer (104) includes a projection (132) positioned within the depression (122) to together define the cross-sectional shape of the microchamber (140).