Hardmask compositions for resist underlayer film and method for producing semiconductor integrated circuit device using the same
US7514199B2 · kind B2 · utility
8Cited by
3References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2006 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | May 26, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided herein are hardmask compositions for resist underlayer films, wherein in some embodiments, the hardmask compositions include Further provided herein are methods for producing a semiconductor integrated circuit device using a hardmask composition according to an embodiment of the present invention. In addition, provided herein are semiconductor integrated circuit devices produced by a method embodiment of the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.