Built-in attachment device using selective laser sintering
US7514649B2 · kind B2 · utility
0Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2005 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Sep 6, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2077/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of assembling a first part and a second part. The method includes the step of integrally forming an attachment device and a first part. For example, the attachment device may be a nut plate operative to retain a nut therein, and the first part may be an air duct. The nut plate and the air duct may be integrally formed via selective laser sintering or stereo lithography such that the nut plate is an integral feature of the air duct. A nut may be retained in the nut plate, and a mating bolt may engage the nut to attach the air duct (i.e., the first part) to the second part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.