Adjustable height liquid cooler in liquid flow through plate
US7515418B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2006 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Jun 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An arrangement having a cooling function is provided, comprising a circuit board, a plurality of heat generating devices attached to the circuit board, a cooling device thermally connected to one of the plurality of electronic devices, and a coolant plate. An example of the arrangement can include a source of pressurized coolant fluid connected to the coolant plate and adapted to cause the coolant fluid to be transferred between the coolant plate and the cooling device. In addition or alternatively, the arrangement can include a plurality of flexible conduits and an adjustment device adapted to selectively adjust he height of the cooling device. In addition or alternatively, a cooling apparatus within a cooling arrangement can comprise a cooling device, a coolant plate, and a coolant pathway including a first passage formed in the coolant plate and a second passage formed in the cooling device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.