Patent · US Expired

Electronic device comprising secure heat dissipation

US7515421B2 · kind B2 · utility

2Cited by

28References

26Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Walter Apfelbacher · Freihung, DE
Thomas Kurbjuweit · Amberg, DE
Annemarie Lehmeier · Ursensollen, DE
Norbert Reichenbach · Amberg, DE

Key dates

Filing date	Feb 17, 2004
Grant date	Apr 7, 2009
Priority date	—
Expiry date	Jan 2, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/209
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A multi-component housing including a housing shell and a housing lid is disclosed. A support plate that is fitted with at least one power electronics component is disposed on a base plate of the housing shell. The housing lid supports a mounting device for fastening the housing to a cooling body by pressing the support plate to a supporting area of the cooling body. At least one supporting element is provided for transferring a pressing force that is applied in the direction of the base plate from the housing lid to the housing shell.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.