Nozzle plate producing method
US7516549B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 5, 2006 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Feb 10, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for producing a nozzle plate comprises a liquid-repellant coat removal step for conducting a plasma treatment to each chip from a same side as a liquid droplet ejecting surface under an atmospheric pressure, while supplying a gaseous mask material for protection of the liquid-repellant coat through nozzle holes from an opposite side of the liquid droplet ejecting surface in such a manner that the gaseous mask material is leaked out over the liquid droplet ejecting surface around the nozzle holes, to thereby remove the liquid-repellant coat exposed outside the mask material; and a bonding step for bonding each chip to the nozzle plate body at the area from which the liquid-repellant coat is removed by the liquid-repellant coat removal step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.