Method and apparatus for joining protective tape
US7516768B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2005 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Oct 13, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/108
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a method for allowing a cutter blade to relatively travel along an outer periphery of a semiconductor wafer to cut a protective tape joined to a surface of the semiconductor wafer in conformity with an outer shape of the semiconductor wafer, the cutter blade is allowed to relatively travel along the outer periphery of the semiconductor wafer with a positioning notch provided on the outer periphery thereof. The cutter blade is rotationally turned at the fore half of the notch recessed on the outer periphery of the semiconductor wafer during the relative travel of the cutter blade in such a manner that its blade tip is directed toward the center of the wafer. In contrast, the cutter blade is rotationally turned at the rear half of the notch in such a manner that its blade tip is directed toward the outer periphery of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.