Mount assembly for electronic devices
US7516928B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2007 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | May 10, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/32737
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A mounting assembly for portable electronic devices includes a mount (12) with a mounting ball (16) that mates with a socket assembly (22) formed in a housing (18) of an electronic device (20). The socket assembly includes an orifice (32) formed in the back of the housing, a seat (34) positioned in the orifice for matingly receiving the ball, and a spring element (36) partially surrounding the seat. The seat includes a concave center portion (38) and a plurality of flexible, interconnected arms (40,42,44) extending from the concave center portion. The spring element substantially encircles the flexible arms to allow the flexible arms to flex outward when receiving the ball and to then contract inwardly to contact the ball when the ball is seated fully in the seat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.