Valve pin bushing having a thermally insulative component
US7517214B2 · kind B2 · utility
4Cited by
8References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2007 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Jun 3, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2889
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A valve pin bushing for a hot runner includes a bushing body having a hole therethrough for receiving a valve pin and a rearward surface for contacting a back plate. A thermally insulative component is coupled to a forward surface of the bushing body. The thermally insulative component is made of a nonmetallic material having a thermal conductivity lower than that of the bushing body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.