Plasma treatment apparatus
US7517429B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 3, 2007 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Apr 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/022
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a plasma treatment apparatus, and more particularly, to a plasma treatment apparatus capable of supplying pressure gas while preventing flying of particles accumulated on the bottom of a chamber. The plasma treatment apparatus of the present invention comprises a chamber; an intake/exhaust portion provided to the bottom of the chamber to supply the chamber with pressure gas, the intake/exhaust portion being configured such that an inner diameter thereof is increased upwardly; and a pressure gas source connected to the intake/exhaust portion to supply the pressure gas thereto. The apparatus may further comprise a vacuum source connected to the intake/exhaust portion to exhaust the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.