Curable sealant composition
US7517936B2 · kind B2 · utility
0Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2004 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Oct 11, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J115/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable sealant composition is provided. The composition includes a polymer including at least conjugated dime contributed monomer units in a backbone of the polymer and terminal groups including silicon. The composition also includes additional sealant ingredients selected from the group consisting of plasticizers, filler, reinforcing agents, modifiers, curing catalysts/hardeners, stabilizers, and mixtures thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.