Encapsulation for organic device

US7518142B2 · kind B2 · utility

Assignee

• Applied Materials GmbH & Co. KG · DE

Inventors

• Uwe Hoffmann · Leverkusen, DE
• Jose Manuel DIEGUEZ-CAMPO · Hanau, DE
• Frank Stahr · Radeberg, DE
• Klaus Schade · Wiesbaden, DE

Key dates

• Filing date: Jun 12, 2007
• Grant date: Apr 14, 2009
• Expiry date: Jun 12, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K2102/351

Abstract

The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.