Electric component with a flip-chip construction

US7518249B2 · kind B2 · utility

Assignee

• EPCOS AG · DE

Inventors

• Hans Krueger · Munich, DE
• Karl Nicolaus · Munich, DE
• Juergen Portmann · Peising, DE
• Peter Selmeier · Haag in Oberbayern, DE

Key dates

• Filing date: Jun 8, 2005
• Grant date: Apr 14, 2009
• Expiry date: Jun 27, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/014
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A component includes a carrier substrate having a coefficient of thermal expansion αp and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion α1 in a first direction x1 and a first expansion difference, Δα1 equal to the absolute value of αp−α1. The chip also has a second coefficient of thermal expansion α2 in a second direction x2 and a second expansion difference Δα2 is equal to the absolute value of αp−α2,. The bumps are arranged such that a first distance, Δx1, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction x1 is less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x2.