Multi-substrate integrated sensor
US7518354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2007 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Jun 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/4903
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic circuit includes a first substrate having a first substrate surface and a device supported by the first substrate surface. The device is selected from among a passive electronic component and an active electronic component. The electronic circuit also includes a second substrate having a second substrate surface and a conductor proximate to the second substrate. The electronic circuit also includes a magnetic field transducer disposed over the conductor and coupled to the device and an insulating layer disposed between the conductor and the second substrate. The conductor is adapted to carry an electrical current to generate a first magnetic field. The electronic circuit is responsive to the first magnetic field. In some embodiments, the conductor is a secondary conductor and the circuit further includes a primary conductor disposed proximate to the magnetic field transducer and an insulating layer disposed between the primary conductor and the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.