Electrooptical device, mounting structure, and electronic apparatus having wiring formed on and protruding from a base material to directly under an input bump on a semiconductor device
US7518691B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2005 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Jun 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An electrooptical device includes a substrate that holds an electrooptical substance, a first substrate line and a second substrate line provided on the substrate, a semiconductor device provided on the substrate, a first input bump and a second input bump provided on a surface of the semiconductor device, the surface being close to the substrate, an output bump provided on the surface of the semiconductor device to be connected to the first substrate line, a base material mounted on the substrate, a first line provided on the base material to be electrically connected to the first input bump, and a second line provided on the base material to be electrically connected to the second input bump via the second substrate line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.