Heat spreader, semiconductor package module and memory module having the heat spreader
US7518873B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2006 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Jul 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.