Transparent window with non-transparent contact surface for a soldering bonding
US7520416B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2003 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Oct 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A transparent pane, in particular a glass pane, having at least one electroconducting, non-transparent contact surface placed on one of its surfaces, to connect it by soldering to a connection piece. In the region of the soldering location, the contact surface has at least one cutout via which the soldering filler metal is visible through the pane after the connection piece has been soldered to the contact surface. Such a configuration allows reliable visual verification of the soldering locations, even in cases in which the soldering location is incorporated within a composite glazing panel and has been soldered, if necessary by induction heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.