Method of sealing an interface
US7521093B2 · kind B2 · utility
27Cited by
110References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2005 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Mar 21, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0647
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of sealing an interface, the method comprising: providing a sealant material, locating the sealant material adjacent to the interface, exposing the sealant material to an elevated temperature such that the sealant material flows adjacent the interface, and curing the sealant material to seal the interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.