Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives
US7521125B2 · kind B2 · utility
1Cited by
66References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2005 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Apr 23, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.