Positive photosensitive resin, process for production thereof, and resist composition containing positive photosensitive resin
US7521171B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2006 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Nov 21, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0397
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The positive photosensitive resin of the present invention has an acid-labile protecting group and the structure represented by the following general formula (1):(wherein X1 and X2 may be the sake or different and each independently a straight or branched chain hydrocarbon group, having 1 to 30 carbon atoms, an alicyclic hydrocarbon group or a heterocyclic group, which may substituted with straight or branched chain hydrocarbon of 1 to 6 carbon atoms or —O— hydrocarbon; Y1 and Y2 may be the same or different and are each independently a hydrogen atom, a straight or branched chain hydrocarbon group having 1 to 6 carbon atoms, a sulfur-containing hydrocarbon group, or an aromatic hydrocarbon group which may have a substituent; and two Zs may be the same or different and each independently an oxygen atom or a sulfur atom).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.