Controlled cooling methods and apparatus for laser sintering part-cake
US7521652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2004 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Jan 5, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention is a method for controllably cooling at least a portion of a part-cake from a laser sintering system to minimize cool down time, maximize throughput, and minimize thermal gradients within the part-cake. The method generally comprises forming one or more thermal transfer channels within the part-cake. The thermal transfer channels can include ducts and cooling fins in the part-cake surrounding the formed part. The method can further comprise removing unfused powder from the ducts and introducing cooling media into the ducts. The invention also includes a part-cake having thermal transfer channels formed therein and a laser sintering apparatus comprising a part-cake containing cylinder having permanent fittings therein for receiving terminal portions of thermal transfer channels formed in the part-cake.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.