Method and apparatus for dissipating heat from an integrated circuit
US7521791B2 · kind B2 · utility
1Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2006 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Sep 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus (100) is provided for dispersing heat from an integrated circuit (202) to a heat sink (404). The apparatus (100) is formed on a nonconductive body (102) having at least two conductive surfaces (110, 112) disposed thereon. One of the conductive surfaces (110) is reflowed to a heat generating lead of the integrated circuit (202), and the other conductive surface (112) provides a surface for contacting a heat sink (404). The apparatus (100) and integrated circuit provide a package (200) which can be tape and reeled (300) for easy mounting to a printed circuit board (402) of a communication device (400).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.