Boundary acoustic wave device and method for manufacturing boundary acoustic wave device
US7522020B2 · kind B2 · utility
6Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 7, 2008 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Jan 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/02228
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A boundary acoustic wave device has a small thickness, which is suitable for thin apparatuses, and can be manufactured at low cost. The boundary acoustic wave device includes a first IDT electrode disposed on a first surface of a substrate, a first insulating film covering the first IDT electrode, a second IDT electrode disposed on a second surface of the substrate, and a second insulating film covering the second IDT electrode. Either the substrate or the first and second insulating films have piezoelectric characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.