Heating resistance element, thermal head, printer, and method of manufacturing heating resistance element
US7522178B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2006 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Oct 3, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/33585
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal head is structured to have a substrate, a thermal storage layer formed on one surface of the substrate and made of glass, and heating resistors provided on the thermal storage layer. A plurality of hollow portions are formed at a position spaced apart from a surface where the heating resistors are formed by laser processing using a femtosecond laser, in an area of the thermal storage layer which is opposed to the heating resistors. In this way, to provide a heating resistance element for improving heating efficiency of heating resistors to reduce power consumption, improving strength of a substrate under the heating resistors, and for enabling simple manufacture at a low cost, a thermal head and a printer using the same, and a method of manufacturing a heating resistance element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.