Semiconductor laser device
US7522643B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2005 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Jul 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/405
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a semiconductor laser apparatus having a metal body which efficiently cools a semiconductor laser element, in which joining of copper-made members coated with DLC layers and prevention of corrosion in the vicinity of joined portions are possible. The semiconductor laser apparatus has a metal body as a heat sink for cooling the semiconductor laser element. The metal body is constituted by a plurality of copper-made members, and the surfaces of each copper-made members are continuously coated with a diamond carbon layer except for regions corresponding to an exposed region in which the semiconductor laser element is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.