Method for manufacturing keypad
US7523544B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 25, 2007 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Aug 21, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4998
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a method for manufacturing compact keypad, a first molding die with bottom surface of smooth face, matted face or patterned layer is prepared. Colloid is injected into the first molding die and a first carrier covers the surface of the colloid. A rolling wheel presses the first carrier and the colloid evenly into the first molding die. The colloid is cured by UV light to form a keypad layer attached on the first carrier. A background color layer, a functional color layer and a textual color layer are formed on the first carrier. A second carrier is prepared and a reflection layer is printed on the surface of the second carrier. The second carrier and silicon rubber are placed into a second molding die and thermally pressed therein to form a resilient layer. The resilient layer is adhered with the keypad layer to form the keypad panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.