Process to open connection vias on a planarized surface
US7523550B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2006 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Nov 4, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over a substrate and is covered with a thick layer of alumina. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.