Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
US7523617B2 · kind B2 · utility
104Cited by
60References
98Claims
0Family size
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Key dates
| Filing date | Oct 22, 2004 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Jun 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.