CMP composition comprising surfactant
US7524347B2 · kind B2 · utility
11Cited by
44References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2004 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Oct 5, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a polishing composition comprising fumed alumina, alpha alumina, silica, a nonionic surfactant, a metal chelating organic acid, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, and abrading at least a portion of the substrate to polish the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.