Method of interconnecting terminals and method of mounting semiconductor devices
US7524748B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 4, 2004 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Feb 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0425
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.