Packaging for proximity communication positioned integrated circuits
US7525199B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2004 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Jul 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of integrated circuit packages are disposed on a substrate. The plurality of integrated circuit packages includes a first type of integrated circuit package that has an inactive side facing the substrate and an active side facing away from the substrate. The plurality of integrated circuit packages also includes a second type of integrated circuit package that has an inactive side facing away from the substrate and an active side facing the substrate. The first type of integrated circuit package and the second type of integrated circuit package are disposed such that a proximity communication enabled portion of the first type of integrated circuit package is aligned with a proximity communication enabled portion of the second type of integrated circuit package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.