Power converter having multiple layer heat sinks
US7525803B2 · kind B2 · utility
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5Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 31, 2006 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Nov 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configured as planar sheets, each of these heat conductive layers being coupled to at least one wire to sink heat therefrom, such as via a wire of an input cable and/or output cable. Advantageously, a more compact power converter is realized having improved power output while operating within safety guidelines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.