Electronic component cooling apparatus
US7527085B2 · kind B2 · utility
45Cited by
15References
28Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 2, 2005 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Nov 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink 3, a radiator 7 cooled by an electric fan 5, first and second coolant paths 9, 11 for circulating a coolant between the heat sink 3 and the radiator 7, and an electric pump 13 to supply a moving energy to the coolant. The electric pump 13 is arranged at a position facing the heat-radiating portion of the radiator 7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.