Exposure method and exposure apparatus
US7527917B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2005 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Apr 18, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70425
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
For each of pattern projection regions, a mask and a substrate are moved in synchronization with each other in an X direction while projecting a portion of a mask pattern through an optical projection system onto a portion of the pattern projection region. An exposure region is thereby shifted from one of two ends of the pattern projection region toward the other end, the two ends being opposed to each other in the X direction. If the pattern projection region is a peripheral projection region that has a portion located outside the edge of the substrate, of the two ends of the region opposed to each other in the X direction, the exposure region is shifted from the one end that is greater in length of a portion laid over the substrate toward the other end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.