Systems and methods for solder bonding
US7528061B2 · kind B2 · utility
2Cited by
4References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2005 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Jun 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for solder bonding that employ an equilibrium solidification process in which the solder is solidified by dissolving and alloying metals that raise the melting point temperature of the solder. Two or more structure surfaces may be solder bonded, for example, by employing heating to melt the solder and holding the couple at a temperature above the initial solder melting point of the solder until interdiffusion reduces the volume fraction of liquid so as to form a solid bond between surfaces before cooling to below the initial melting point of the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.