Low bake, low VOC conductive primer
US7528190B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2005 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Oct 15, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/0025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides for a sealer/primer that is generally cured at low bake temperatures. The composition utilizes a resin system to provide both conductivity and adhesion of the coating onto plastic substrates. The present invention uses a polyester, such as one that includes unsaturated polyester, in combination with other resins, including an acrylic, crosslinking agent and conductive pigment to create a conductive primer that can be cured at low temperatures. The composition can be applied through traditional application equipment, seals the surface of the substrate to which it is applied, and cures to an acceptable surface for further processing, such as painting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.