Substrate, device and method for forming a guidance structure in the substrate, and positioning method
US7529449B2 · kind B2 · utility
1Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2005 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Dec 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate is bonded to a semiconductor integrated circuit to which plural solder bumps have been adhered. The substrate includes: plural contact portions that are disposed at positions corresponding to the positions of the plural solder bumps and include contact surfaces which contact the solder bumps; and a guidance structure that is disposed in the contact surfaces and, when the solder bumps are melted, guides the melted solder bumps to predetermined regions within the contact surfaces. The predetermined regions are set so that the semiconductor integrated circuit and the substrate are properly aligned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.